Technology

Vertical dipping technoque is adapted to a horizontal furnace. The wafers are fixed in a substrate holder, backside to backside. When the layer-growth should start, the wafers are dipped into the first, then into the next, up to six different melts of the crucible. At the end of epi-process, the wafers are pulled out of the last melt, and cooled down to room temperature for unloading.